|
|
Design of Hot Melt Glue Gun
Zelenitca, Darina ; Bukvald, Jiří (referee) ; Sládek, Josef (advisor)
The topic of this bachelor thesis is the design of a hot glue gun. Thesis engages in design, technical and marketing analyzes, which indicate the weak sides of the product. The goal is to propose a design, which will respond to costumers’ requirement. To propose a design, which will solve problems and will improve technical, ergonomic and esthetic side of the product.
|
|
|
Adjustment of the Insulation of the Bus Rear Part
Pešina, Jan ; Kubík, Roman (referee) ; Kalivoda, Milan (advisor)
Master thesis is focused on proposal of improved manufacturing process of assembly named "sandwich" produced in Iveco bus company. There is solved new fixation of assembly bench, replacement of currently used glues and material of ledge as well. In the first part there is company introduction Iveco Bus. Second part consist of construction analysis and description of present manufacturing process. Further there is introduction, solving out of thesis topics and proposal of new manufacturing process is written. At the end of thesis are attached comparison between present and proposed manufacturing process.
|
|
|
Effect of surface on bonded joint
Trhoň, Vojtěch ; Halamík, Tomáš (referee) ; Kubíček, Jaroslav (advisor)
This master’s thesis is divided into two parts. In the first part are these topics: bonding theory, treatment of bonding surface, types of adhesives, adhesives in the transportation industry and construction and stress of bonded joints. In the second part of this thesis is experimental evaluation of the effect of surface of material on strength of bonded joint.
|
|
|
Defects caused of Solder Paste Application and Process Optimizing
Štichová, Zuzana ; Žilina, Michal Staník, EMTEST (referee) ; Starý, Jiří (advisor)
The aim of this work is documentation of cases, where the problems appear of solder paste reflow process, evaluation and recommendation for increasing quality of proposal PCB. This work contains also recommendation of process using adhesives for double-sided SMD assembly. At the cooperation with the firm Emtest, a.s. in Žilina, I mostly intent on optimalization of proposal footprints and realization of their changes as the one way of solving the problem. I made also statistics of solder paste reproducibility by JetPrinting technology.
|
|
| |
|
|
Bonding of thin metal sheets
Poul, David ; Kubíček, Jaroslav (referee) ; Dvořák, Milan (advisor)
Bachelor thesis is focused on theory and methods of adhesive bonding. Experimental part is focused on two topics: determining dependences of bonded joint shear tension on a cure time and determining dependences of bonded joint shear tension on a size of contact area. Loctite SI 5399 RD acetoxy silicone one component glue was used for these experiments. At determining dependences of bonded joint shear tension on a size of contact area tension is raising, but the grow wasn’t directly proportional on the grow of size of contact area. Determining dependences of bonded join shear tension on a cure time it was proved, that tension is raising first 24 hours very quickly. After this period is process slowing down and tension is increasing to its maximum. After 18 hours bond tension is solid enough to be handling, but 24 hours of curing time is more secured.
|
|
|
Analysis of adhesives in general engineering
Trhoň, Vojtěch ; Kovář, Petr (referee) ; Kubíček, Jaroslav (advisor)
This bachelor thesis is concerned with analysis of adhesives in general engineering and it is focusing on the partition of adhesives according to curring and usability. Positive and negative mechanical stress of glued joints are characterised here. The technologic process of gluding side panels of tram is elaborated in the end of this bachelor thesis.
|
|
|
Gluing of FDM 3d printed parts from PLA
Šlimar, Filip ; Slaný, Martin (referee) ; Zemčík, Oskar (advisor)
The thesis deals with the theory of 3D printing, materials for printing and bonding. It focuses on FDM printing and PLA material. It also compares gluing with other methods and deals with the distribution of adhesives, the gluing procedure and tests of glued joints. The work, based on literature studies, proposes an experiment to evaluate selected adhesives. The practical part contains a description, results and evaluation of the experiment. The evaluation of adhesives is based on tensile and shear strength.
|
|
|
Study of durability of wood glue bonds against increased temperature
Kučera, Vít ; Vejpustek,, Zdeněk (referee) ; Vaněrek, Jan (advisor)
In this time are for design of wooden elements available simplified procedures for fire modeling which defines ČSN EN 1991-1-2. But it is not experimentally tested the impact of adhesive on the final value of fire resistance of laminated panels. This diploma thesis solves basic normative practices that could explain the durability of glue bond against increased temperatures. in the practical part will be undertaken to experimentally assess the impact of various kinds of adhesive-based (epoxy, formaldehyde, PUR and EPI) on the glued bond durability against increased temperature. Glued joints that will be subjected to gradual temperature exposure in order to assemble the dependence of the temperature influence on the final strength of the joint according to the type of adhesive.
|
|
|
Semiautomatic Dispenser Application in Flexible Low Series PCB Assembly in SMT
Prikryl, Petr ; Zatloukal, Miroslav (referee) ; Starý, Jiří (advisor)
The aim of this thesis is solving the issue of introducing the Dotmaster semi-automatic dispenser into the flexible low series surface mount technology assembly of printed circuit boards. The first part of the thesis deals with the issue of introduction to the dispension of solderpastes, adhesives and packaging materials. The second part is focused on the description of the Dotmaster semi-autamatic. The last part is devoted to actual measuring and observation with the device using PD 860002 SA adhesive made by Heraeus company and SAC solder paste by Kester company. Showing the characteristics of dependecies of the shape of the dispensed adhesive and solder paste on several parameters of dispension follows.
|
guest ::
