|
|
Reliability of LED Panels Solder Joints
Šimon, Vojtěch ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
Thesis is focused on the effect of heating factor on quality of solder joints. In theoretical part is solved reflow soldering technology, problematice of solder paste choice or criteria of soldering profile setting. The practical part is dedicated to demonstrating the impact of heating factor on solder joint quality. There are used X-Ray analysis, microsections and electron microscopy. In the final part of this thesis are summarized knowledge from theoretical part and experimental obtained results to defend of next steps in diploma thesis.
|
|
| |
|
|
Reactive Nanoparticles Application to SAC 305 Solder Paste
Matras, Jan ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
This work is a research on the topic of reactive nanoparticles and their agitation into the solder paste, which it also describes. It describes in detail the properties of each solder alloys. It explains the creation of intermetallic layers in the soldering process and examines their structure. It also focuses on the evaluation and methodology of testing the properties of solder pastes. In the practical part, individual tests are performed with PF606 and PF610 solder paste.
|
|
|
Inspection and optimization of soldering profiles of reflow furnaces
Flos, Milan ; Zatloukal, Miroslav (referee) ; Bača, Petr (advisor)
This thesis is focused on the implementation of solutions for the control of temperature profiles in an industrial environment. The theoretical part deals with the soldering process itself, individual types of soldering and their possible defects. Furthermore, the problem of temperature profiles, their division and the advantages and disadvantages of individual profiles were discussed. Subsequently, the measurement was performed on several remelting furnaces and its evaluation. Lastly, the design of the holder for the profilometer and the PCB itself was created.
|
|
|
Precise setup of production process to minimalize presence of voids in solder joints where were used alloy SAC305
Slavík, Pavel ; Macho, Tomáš (referee) ; Valach, Soběslav (advisor)
The theoretical part of dissertation is devoted to familiarization with the process of assembly and soldering of PCBs. There are described the selected types of lead-free solder paste, the various procedures of flux deposition, where the greater part is focuses to the printing through template. Also, I analyze the different procedures shouldering and soldering. I focused mainly on the mechanical mounting of SMD components soldering with help convection reflow and soldering in the vapor. In the practical part is described the design of the test PCB, methodology of assembly PCB and soldering various technologies with predefined settings. The analysis of the results is done by a non-destructive x-ray method and destructive micro-cut method. The x-ray method detects the position and size of the voids in the solder. This information is used for faster processing of micro-cut. The micro-cut method is included in the analysis for a more detailed examination of the solder joint. At the end of the thesis, there is a summary of the recommendation that the setting of the manufacturing process increases the quality of the brazed joint.
|
|
|
SnBi Solder Paste and Influence of Reactive Nanoparticles
Rychlý, Ivo ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
This work deals with effects of nanoparticles, mainly copper and silver, on properities of lead-free solder pastes. It describes basic tests done on solder pastes according to IPC-TM-650 standards. In practical section this work focuses on the preparation of Sn-Bi solder paste and the measuring of viscosity. After that different concentrations of silver copper alloy nanoparticles are added to the SnBi solder paste. These solder pastes are tested by the IPC standarts and mechanical and resistive tests are done on printed circuit boards where the effects of mixed in nanoparticles are observed.
|
|
|
Reactive Nanoparticles Application to SAC 305 Solder Paste
Matras, Jan ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
This work is a research on the topic of reactive nanoparticles and their agitation into the solder paste, which it also describes. It describes in detail the properties of each solder alloys. It explains the creation of intermetallic layers in the soldering process and examines their structure. It also focuses on the evaluation and methodology of testing the properties of solder pastes. In the practical part, individual tests are performed with PF606 and PF610 solder paste.
|
|
| |
|
|
Reliability of LED Panels Solder Joints
Šimon, Vojtěch ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
Thesis is focused on the effect of heating factor on quality of solder joints. In theoretical part is solved reflow soldering technology, problematice of solder paste choice or criteria of soldering profile setting. The practical part is dedicated to demonstrating the impact of heating factor on solder joint quality. There are used X-Ray analysis, microsections and electron microscopy. In the final part of this thesis are summarized knowledge from theoretical part and experimental obtained results to defend of next steps in diploma thesis.
|
|
|
Analysis of Aplication Flux and Solder Paste on PCB for BGA components
Toufar, Michal ; Řihák, Pavel (referee) ; Vala, Radek (advisor)
This thesis deals with rework of BGA components. There are described defects and errors in a solder joints. The current trend is focused on thin packages with fine pitch. It is assembled with smaller and smaller solder balls. It is described effect of different application of flux and solders paste for rework. The main part is focused on dipping and dispensing. These methods are suitable for repair process.
|
guest ::
