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National Repository of Grey Literature 12 records found  previous11 - 12  jump to record: Search took 0.00 seconds. 
Surface Finishes of Copper in PCBś Production
 Bedlek, Marek ; Zatloukal, Miroslav (referee) ; Starý, Jiří (advisor)
This work examines and compares properties of different types of surface finishes, their qualities and shortcomings and perspective for future use. Emphasis is placed on new product in the field of OSP, Glicoat F2 from SHIKOKU CHEMICALS CORPORATION and immersion tin. It evaluates their influence on solderability and its changes after several reflow cycles and isothermal aging.
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Solder Joint Conductivity - Influence of Solder Volume and Isothermal Aging
 Mach, Ladislav ; Schnederle, Petr (referee) ; Starý, Jiří (advisor)
The master thesis analyses electrical conductivity of lead-free solder joints. The test method design for monitoring the electrical conductivity of the soldered joint is described in the practical part. Simulated BGA package with four pin (BGA4) is used for experiments. Tested PCBs are subjected to isothermal aging and current load. During isothermal aging is measured electrical conductivity and optical microscope is used for intermetallic layer (IMC) growth observation. Two types of surface finish (OSP and ENIG) are used for tests and three diameters of solder terminal balls (solder alloy SAC405). The influence of the ratio area connection / solder volume (ratio S / V) on lead-free solder joints conductivity was evaluated.
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National Repository of Grey Literature : 12 records found   previous11 - 12  jump to record:
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