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Cold Chemical Lamination of Low Temperatue Co-fired Ceramics
Jurásek, Matěj ; Somer, Jakub (referee) ; Štekovič, Michal (advisor)
This paper deals with production of the structures fabricated using low temperature co-fired ceramics. Focus is on the lamination of raw ceramic tapes. There are presented classical thermo-compressive methods and a new method using chemical solutions for tape bonding. Describes new lamination technology and their advantages are the absence of elevated temperatures and high pressures. This method reduces using of higher temperatures and high pressure during lamination. On the other hand, chemical process of tape bonding is not flawless. There are many problems including solvent deposition, extreme sensitivity to dust and other processing parameters. It also describes the fabrication of structures by chemical way. Specifically, analyzes the method Cold Chemical Lamination and provides examples of possible deposition solvents which are needed for etching the surface of the LTCC tape during the lamination.
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Electrical and thermal characteristics of lead-free solder joints
Jurásek, Matěj ; Adámek, Martin (referee) ; Schnederle, Petr (advisor)
This wok is focused on the issue of soldering. The theoretical part describes the basic requirements for materials and solders alloys, which enter into this process. Further also factors that have a major impact on the quality of joints and methods, that are used for final testing of electrical and optical properties. The aim of the practical part of this work will be monitoring changes in electrical properties depending on the base material, surface finish PCB contact surfaces, the type of solder alloy and residual oxygen concentration in the atmosphere. The resulting values are compared, and they will draw the final recommendations for the method of soldering used alloys
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Electrical and thermal characteristics of lead-free solder joints
Jurásek, Matěj ; Adámek, Martin (referee) ; Schnederle, Petr (advisor)
This wok is focused on the issue of soldering. The theoretical part describes the basic requirements for materials and solders alloys, which enter into this process. Further also factors that have a major impact on the quality of joints and methods, that are used for final testing of electrical and optical properties. The aim of the practical part of this work will be monitoring changes in electrical properties depending on the base material, surface finish PCB contact surfaces, the type of solder alloy and residual oxygen concentration in the atmosphere. The resulting values are compared, and they will draw the final recommendations for the method of soldering used alloys
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Cold Chemical Lamination of Low Temperatue Co-fired Ceramics
Jurásek, Matěj ; Somer, Jakub (referee) ; Štekovič, Michal (advisor)
This paper deals with production of the structures fabricated using low temperature co-fired ceramics. Focus is on the lamination of raw ceramic tapes. There are presented classical thermo-compressive methods and a new method using chemical solutions for tape bonding. Describes new lamination technology and their advantages are the absence of elevated temperatures and high pressures. This method reduces using of higher temperatures and high pressure during lamination. On the other hand, chemical process of tape bonding is not flawless. There are many problems including solvent deposition, extreme sensitivity to dust and other processing parameters. It also describes the fabrication of structures by chemical way. Specifically, analyzes the method Cold Chemical Lamination and provides examples of possible deposition solvents which are needed for etching the surface of the LTCC tape during the lamination.
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