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Switch stereo low frequency signals
Lukesle, Václav ; Jankovský, Jaroslav (referee) ; Hejátková, Edita (advisor)
The work proposes steps for fabricating low-frequency preamplifier including switchable inputs and the output equalizer. In the beginning of the thesis theoretical principles of amplifying the low-frequency signals are introduced. For setting the resonance frequency of equalizer the gyrator filter has been used. By setting the aforementioned frequency and tuning the potentiometer we are able to change the quality factor as well as the gain of the entire circuit. Benefit of this work is a large flexibility for tuning the output signal including a possibility of selection of four various inputs. Simulation and measurement results, PCB and a summary of discrete components are finally attached.
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Development of an electric shock welding method for a combination of thin-film and thick-film structures
Hruška, Andrej ; Jankovský, Jaroslav (referee) ; Otáhal, Alexandr (advisor)
At the start this bacherol thesis deals with connection methods of terminals on thick and thin-films. One of the methods, which this thesis is mostly orientated on, is a terminal connecting with the shock welding method. The point was to test, if this method of connecting terminals is suitable for a combination of the thick and thin-films applications. The experiment included making of template for vapour plating, vapour plating of thinfilm on substrate, its galvanic plating and testing. Mechanical tensile strength of created welds was tested and in the end there was done the optical inspection of internal interface of welds.
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Testing of Solders in Protection Atmosphere
Vala, Radek ; Jankovský, Jaroslav (referee) ; Szendiuch, Ivan (advisor)
The project deals with the overall design and construction of equipment called the desiccators for brazing in a protective atmosphere. The device was designed and manufactured cooling and heating element. For the soldering various temperature profiles have been defined and adjusted, as for SnPb as well for lead-free solders. There was a realization of samples were measured and analyzed. Finally were realized micro sections for lead free solder.
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Hot-wire anemometer
Búran, Martin ; Jankovský, Jaroslav (referee) ; Řezníček, Michal (advisor)
The project deals with the effect of the airflow and temperature on the gold wirebond due to possible application in hot-wire anemometry. Theoretical fundamentals of wirebonding and hot-air anemometry are included in the text. From the area of anemometry, there is also a detailed description of measurement principles, areas of application and measuring instruments. The practical part of the text deals with design of the experimental sensor for hot-wire anemometry with use of the gold wirebond, including also the verification of the sensor's properties.
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Conductive net designing for thick film circuits
Strejček, Jindřich ; Řezníček, Michal (referee) ; Jankovský, Jaroslav (advisor)
Bachelor’s thesis was intent on determination the current rating thick film circuits. Describes an intelligent current source with voltage measurement function and its control. Contains a description of testing to test the test structure and processing of its results. From the evidence in trial testing was formed a new test structure, which was used for testing the current rating thic film conductors. Also copper conductors testing was performed. From measured values were drawed the graphs which represents current rating coductors in depend on width and temperature change of conductor.
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New ways in Packaging
Hřešil, Tomáš ; Jankovský, Jaroslav (referee) ; Szendiuch, Ivan (advisor)
This project deals with the creating a base of manual for modern electronic packages, which are more and more used in today's electronic circuits and devices. The modern packages are mentioned small outline DIL, QFP, BGA, PGA, CSP, Flip chip. The work is also including packages known SiP (System in Package) that are consisting or use the combinations of packages BGA, PGA, CSP and Flip Chip. At the end of the work are short described the most important design rules for assembly of mentioned packages on substrate (PCB).
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