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The strength of soldered joints on ceramic substrates
Jansa, Vojtěch ; Nicák, Michal (referee) ; Adámek, Martin (advisor)
This thesis deals with problematic of lead – free soldering and consequent testing of mechanical characteristics of solder joints. The theoretical part is focused on various types of lead – free solders, influence of protective atmosphere on the solders characteristics and mechanical testing of solder joints. Basic materials and thick - films making technology is mentioned. Practical part contains a design of topology that was used for mechanical strength testing of solder joints connecting SMD component and ceramic substrate. Properties of lead – free solder pastes was investigated on various concentrations of O2 and compared with lead soldering paste.

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