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SiO2 etching by Si deposition
 Pokorný, David ; Bábor, Petr (referee) ; Polčák, Josef (advisor)
This bachelor thesis deals with one of the most interesting reactions taking place in the solid phase in UHV conditions and that is decomposition of SiO2 according to the equation Si + SiO2 = 2SiO. It was used the previously untested procedure - providing Si atoms not from substrate, but by direct deposition on the surface of the oxide. As a source of silicon atoms was used effusion cell. Deposition of silicon on SiO2 substrate was used at room temperature and at elevated temperature to clarify the principle of this reaction. The activation energy and temperature dependence of the reaction rate was determined. It was also verified the possibility of etching SiO2 by Si deposition in UHV conditions. The prepared samples were examined by x-ray photoelectron spectroscopy and atomic force microscopy.
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