|
|
Influence of printed board surface finishing on solderability with vapour soldering
Matras, Jan ; Starý, Jiří (referee) ; Šandera, Josef (advisor)
Thesis deals with vapor soldering and wetting the surface with solder during the soldering process. It describes in detail the advantages and disadvantages of various surface finishes on the PCB. Generally characterizes the properties of lead-free solders and fluxes. Describes vapor soldering process, including the properties of the liquid itself. It also focuses on a method of evaluating the wettability by using solder balls and its performance on individual samples surface finishes.
|
|
|
WETTABILITY OF PCB SURFACE FINISHES
Minář, Jan ; Jana, Toulová (referee) ; Starý, Jiří (advisor)
This bachelor’s thesis with measuring of wetting characteristics by the wetting balance method for samples of different surface finishes from the firm Gatema. It deals with influence of the isothermal aging and reflow processes on wetting characteristics of surface finishes ENIG, HAL and immersion tin. The influence of intermetallic layer on the overall wettability is studied in case of the surface finish of immersion tin. Also deals with the wettability of the nickel layer, after stripped off gold, in case of the surface finish of ENIG.
|
|
|
Surface Finishes of Copper in PCBś Production
Bedlek, Marek ; Zatloukal, Miroslav (referee) ; Starý, Jiří (advisor)
This work examines and compares properties of different types of surface finishes, their qualities and shortcomings and perspective for future use. Emphasis is placed on new product in the field of OSP, Glicoat F2 from SHIKOKU CHEMICALS CORPORATION and immersion tin. It evaluates their influence on solderability and its changes after several reflow cycles and isothermal aging.
|
|
| |
guest ::
