Original title: Vývoj lepidla pro čipové komponenty
Translated title: Development of an adhesive for chip components
Authors: Zerzánek, Tomáš ; Skácel, Josef (referee) ; Otáhal, Alexandr (advisor)
Document type: Master’s theses
Year: 2025
Language: cze
Publisher: Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Abstract: [cze] [eng]

Keywords: carbon nanotubes; Electrically conductive adhesive; nanoparticles; thermal conductivity; Elektricky vodivá lepidla; nanočástice; tepelná vodivost; uhlíkové nanotrubičky

Institution: Brno University of Technology (web)
Document availability information: Fulltext is available in the Brno University of Technology Digital Library.
Original record: http://hdl.handle.net/11012/252083

Permalink: http://www.nusl.cz/ntk/nusl-682003


The record appears in these collections:
Universities and colleges > Public universities > Brno University of Technology
Academic theses (ETDs) > Master’s theses
 Record created 2025-06-24, last modified 2025-09-06


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