Original title: Thermomechanical simulation of modern electronic packages
Authors: Skácel, J.
Document type: Papers
Language: cze
Publisher: Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií
Abstract: This paper deals with issue of modern electronic packages mainly thermo-mechanical simulation. The first part is focused on the comparing of QFN (Quad-Flat No leads) and BGA (Ball Grid Array) packages including their advantages and disadvantages. The second part is focused on simulation of these packages in ANSYS program from the point of thermos-mechanical behavior.
Keywords: ANSYS; BGA; QFN; thermo-mechanical behavior
Host item entry: Proceedings of the 21st Conference STUDENT EEICT 2015, ISBN 978-80-214-5148-3

Institution: Brno University of Technology (web)
Document availability information: Fulltext is available in the Brno University of Technology Digital Library.
Original record: http://hdl.handle.net/11012/43004

Permalink: http://www.nusl.cz/ntk/nusl-207195


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Universities and colleges > Public universities > Brno University of Technology
Conference materials > Papers