National Repository of Grey Literature 6 records found  Search took 0.00 seconds. 
Planar Structures for High Frequency Band
Pulec, Jiří ; Pietriková, Alena (referee) ; Maschke, Jan (referee) ; Szendiuch, Ivan (advisor)
The present paper deals with the problematics of the design and technology of planar microelectronic structures for the hign frequency band. These structures were realised on the Department of Microelectronics and their properties were measured on the Department of Radioelectronics. The part of this work is also simulation of some microelectronic structures, where for these simulations the design and simulation tool Ansoft Designer and the FEM tool ANSYS was used. The attention is paid to the discrete devices (coils and capacitors) as well as to the more complex structures (frequency filters). The paper yields the new findings in the field of the design and technology of the discrete components as well as of the more complex systems, these findings can be used as the basis for another research of practical applications.
Optimization of location specimens in temperature chamber
Severa, Tomáš ; Pulec, Jiří (referee) ; Šandera, Josef (advisor)
This work is focused on the temperature distribution in thermal chamber CTS. The temperature in the chamber is measured using thermocouples. The measured values are graphically plotted and evaluated. The temperature distribution in the chamber is simulated in ANSYS Workbench. After optimization of the thermal decomposition, is carried out simulations with DPS. It describes the temperature chamber CTS module Omega TC - 08 and software for the thermal simulation ANSYS Workbench.
Insulating Properties of Flip Chip Structures
Dóczy, Robert ; Šandera, Josef (referee) ; Pulec, Jiří (advisor)
This work deals with the insulation properties of microelectronic structures. Specifically, insulation resistance of the gap that separates the conductive parts of the system. There are also described the influences, which have the effect on insulation resistance and the methods by which the insulation resistance is measured. There are also slightly described the issues of designing microelectronic packages and ways in which the microelectronic chip can be connected to the circuit. In the experimental part, the thesis deals with specific design of microelectronic structure such as flip-chip. Conductive pattern of this structure was made to allow the measurement of insulation resistance which depends on the application materials which were used in structure assembly. For this purpose, the structures also undergo a series of cleaning, whose influence is also discussed.
Trasfer Heat Analysis in Steam Generators in blocks of VVER 440
Roupec, Petr ; Pulec, Jiří (referee) ; Šen, Hugo (advisor)
The aim of this thesis is to analyze the heat transfer in steam generator of blocks in the nuclear power plant VVER 440. The steam generator represents the border between the primary and the secondary circuit. The heat is carried from a warm water from reactor to a cold water. The steam arises after the heat transfer and drives the steam turbine. An important quantity which represents the heat transfer is a heat transfer factor. This thesis is divided into theoretical and a practical part. In the theoretical part is mentioned a principle of the steam generator and the theoretical calculation of the heat transfer factor, which comes first of all from the character of the streaming in the steam generator. The practical part brings a comparison of the heat transfer factor calculated from data measured after the start of the third block of EDU in 1986, with the heat transfer factor which comes from the measurement after the power-increase for 105 % of nominal power of the same block in 2009. Further is shown the prediction of the heat transfer factor for next power-increase and the following service is shown too.
Design and Realization of Structures with Embeded Components
Němec, Tomáš ; Pulec, Jiří (referee) ; Szendiuch, Ivan (advisor)
The master thesis deals with multilayer structures and thick film technology. The main goal of this work is measure basic electric features of structures realized with thick film technology. The results will make possible more accurate design of these structures.
Analyze of Packaging Impact on Insulating properties
Pulec, Jiří ; Hejátková, Edita (referee) ; Szendiuch, Ivan (advisor)
Modern analog systems processing signals with very small amplitude are prone to distortion, which is caused by leakage between signal traces. Causation of this is contamination of insulating gap, which insulates these traces. Goal of this thesis is to design and manufacturing of test structure, which allows classification of influence of contamination on substrate on leakage, and another goal is classification of technologiacal processes in light of contamination of substrate with electroactive inpurities. Based on results of this experiments are defined rules leading to optimizing of properties of manufactured structures. Attention is applied to ceramic substrates with conductive traces which are created with thick film technology.

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8 Pulec, Jan
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