Home > Search Results: Mgr. Petr Klapetek Ph.D
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National Repository of Grey Literature 2 records found  Search took 0.00 seconds. 
Submicron Structures with Deep Relief — Technology of Preparation
 Matějka, Milan ; Kuřitka,, Ivo (referee) ; Mgr. Petr Klapetek Ph.D (referee) ; Kolařík, Vladimír (advisor)
The dissertation thesis is focused on research and development in the field of microfabrication by the technology of electron beam lithography. In the first part of this work, the extensive study is conducted in the field of technology of electron beam lithography in terms of physical principles, writing strategies and resist materials. This is followed with description of physical principles of etching for the transfer of relief structures into substrates. The thesis describes innovative techniques in modelling, simulation, data preparation and optimization of manufacturing technology. It brings new possibilities to record deep binary or multilevel microstructures using electron beam lithography, plasma and reactive ion etching technology. Experience and knowledge in the large area of microlithography, plasma and anisotropic wet-etching of silicon have been capitalized to the design process of manufacturing of nano-patterned membranes. It was followed with practical verification and optimization of the microfabrication process.
Detailed record
Submicron Structures with Deep Relief — Technology of Preparation
 Matějka, Milan ; Kuřitka,, Ivo (referee) ; Mgr. Petr Klapetek Ph.D (referee) ; Kolařík, Vladimír (advisor)
The dissertation thesis is focused on research and development in the field of microfabrication by the technology of electron beam lithography. In the first part of this work, the extensive study is conducted in the field of technology of electron beam lithography in terms of physical principles, writing strategies and resist materials. This is followed with description of physical principles of etching for the transfer of relief structures into substrates. The thesis describes innovative techniques in modelling, simulation, data preparation and optimization of manufacturing technology. It brings new possibilities to record deep binary or multilevel microstructures using electron beam lithography, plasma and reactive ion etching technology. Experience and knowledge in the large area of microlithography, plasma and anisotropic wet-etching of silicon have been capitalized to the design process of manufacturing of nano-patterned membranes. It was followed with practical verification and optimization of the microfabrication process.
Detailed record

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