National Repository of Grey Literature 63 records found  1 - 10nextend  jump to record: Search took 0.01 seconds. 
Design of Reflow Soldering Station for Reballing of BGA Packages
Janiš, Adam ; Szendiuch, Ivan (referee) ; Otáhal, Alexandr (advisor)
This thesis deals with the design of a soldering oven for BGA reballing in a nitrogen protective atmosphere. The principles of reflow soldering, the advantages of a nitrogen protective atmosphere on the quality of solder joints and the types of soldering devices are described. The BGA packages´ part consists of their characteristics, assembling methods, a rework and repair process and solder joint inspection methods. Design of the device, as well as heat flow simulations, are included in the experimental part and particularly it also describes the used structural elements and the principle of function of the individual parts of the device. At the end of this work, the soldering process was measured and the ability of the sample soldering was verified.
Optimization of fabrication technology for ceramics packages
Pavlas, Ondřej ; Szendiuch, Ivan (referee) ; Skácel, Josef (advisor)
This bachelor thesis „Optimalization of fabrication technology for ceramics packals“ tackles the issues of ceramic packaging technology for microelectronics applications. This thesis deals with experimental production of ceramic packages from milling to sintering and the dispense printing with a straight capillary a tan angle 45°
Applications of Adhesives in Microelectronics Assembly
Bolcek, Martin ; Jankovský, Jaroslav (referee) ; Szendiuch, Ivan (advisor)
This bachelor´s thesis deals with issue of electrical and thermal conductive adhesive in microelectronics assembly. It also describes structure, atributes and methods of applying adhesive to a printed circuit boards. The following section is an experimental and discusses environmental influences, as increase humidity and temperature, on properties of conductive adhesive joint.
Applications of Adhesives in Microelectronics Assembly
Bolcek, Martin ; Jankovský, Jaroslav (referee) ; Szendiuch, Ivan (advisor)
This bachelor´s thesis deals with issue of electrical and thermal conductive adhesive in microelectronics assembly. It also describes structure, atributes and methods of applying adhesive to a printed circuit boards. The following section is an experimental and discusses environmental influences, as increase humidity and temperature, on properties of conductive adhesive joint.
Economic encapsulation for integrated circuits and modules
Kristek, Michal ; Jankovský, Jaroslav (referee) ; Szendiuch, Ivan (advisor)
This Master´s thesis is about ways of packages of integration circuits and modules. Especially it´s about non-hermetic types of packages. One part of this paper are basic information about packaging and aspects in design of package. Next parts are design of test samples, which are package to epoxide powder material. Based on the results of the tests method, it will propose, where the technology will be used.
Study of Free-Field Photovoltaic Plants in South Moravia
Bařinka, David ; Jandová, Kristýna (referee) ; Szendiuch, Ivan (advisor)
This dissertation is the study about the future of solar power stations in the Czech Republic, describing the history, composition, principle of solar power stations and types of defects. Is primarily focuses on the future and recycling of solar power stations and solar panels. The conclusion of this disertation describes and evaluates own survey which is oriented on operators of the solar power stations.
Planar Structures for High Frequency Band
Pulec, Jiří ; Pietriková, Alena (referee) ; Maschke, Jan (referee) ; Szendiuch, Ivan (advisor)
The present paper deals with the problematics of the design and technology of planar microelectronic structures for the hign frequency band. These structures were realised on the Department of Microelectronics and their properties were measured on the Department of Radioelectronics. The part of this work is also simulation of some microelectronic structures, where for these simulations the design and simulation tool Ansoft Designer and the FEM tool ANSYS was used. The attention is paid to the discrete devices (coils and capacitors) as well as to the more complex structures (frequency filters). The paper yields the new findings in the field of the design and technology of the discrete components as well as of the more complex systems, these findings can be used as the basis for another research of practical applications.
Non-conventional Applications in Thick Film Technology
Krejčí, Pavel ; Řezníček, Michal (referee) ; Szendiuch, Ivan (advisor)
This work deals with issues of application of the thick film technology in the non-conventional field. It includes the essential core of this technology, the overview of producers focusing on manufacturing thick film pastes and concrete examples of application. The general aim is to present growing opportunity of non-conventional application of thick film to the reader and to stimulate the imagination towards inventing new applications. In the experimental part of this work a design of a planar inductor on organic and anorganic substrate is carried out using thick film technology, screen and paste for high resolution.
Investigation of Reliability for Solder Joints
Toufar, Michal ; Somer, Jakub (referee) ; Szendiuch, Ivan (advisor)
It evaluates the importance of soldering in a protective atmosphere. Factors influencing the process of reflow soldering in a protective atmosphere of nitrogen. Evaluates the quality of solder joints due to a defined residual oxygen during the soldering proces. According finishes used on the resulting quality connections for two types of lead free solder.
Investigation of Reliability for Solder Joints in Nitrogen Atmosphere
Vala, Martin ; Adámek, Martin (referee) ; Szendiuch, Ivan (advisor)
This thesis examines the influence of nitrogen atmosphere on the quality of the solder joint lead-free solder paste. For the solder paste were measured and set temperature profiles. Thesis includes the implementation and measurement of samples in a protective nitrogen atmosphere and without a protective atmosphere. These measurements are compared, and the conclusions were drawn for the influence of nitrogen atmosphere. The reliability and the quality of the soldered joints were investigated.

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