Original title: Streamlining the Process of Cleaning PCB after Removing BGA
Authors: Starčok, Tomáš
Document type: Papers
Language: slo
Publisher: Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií
Abstract: This paper deals with issues connected with solder residues cleaning process of modern BGA packages. First part is focused on contact cleaning method of solder residues. It describes main disadvantages and incurred defects of this method. Second part is focused on a new contactless cleaning method with special tool and then suggests variety of verification possibilities.
Keywords: BGA; residues; rework; solder
Host item entry: Proceedings of the 22nd Conference STUDENT EEICT 2016, ISBN 978-80-214-5350-0

Institution: Brno University of Technology (web)
Document availability information: Fulltext is available in the Brno University of Technology Digital Library.
Original record: http://hdl.handle.net/11012/83928

Permalink: http://www.nusl.cz/ntk/nusl-383646


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Universities and colleges > Public universities > Brno University of Technology
Conference materials > Papers