Original title: SnBi pájecí pasta a vliv reaktivních nanočástic
Translated title: SnBi Solder Paste and Influence of Reactive Nanoparticles
Authors: Rychlý, Ivo ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
Document type: Master’s theses
Year: 2018
Language: cze
Publisher: Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Abstract: [cze] [eng]

Keywords: copper; IPC-TM; nanoparticles; silver; SnBi; solder paste; tests on PCB; viscosity; IPC-TM; měď; nanočástice; pájecí pasta; SnBi; stříbro; viskozita; zkoušky na DPS

Institution: Brno University of Technology (web)
Document availability information: Fulltext is available in the Brno University of Technology Digital Library.
Original record: http://hdl.handle.net/11012/81212

Permalink: http://www.nusl.cz/ntk/nusl-377337


The record appears in these collections:
Universities and colleges > Public universities > Brno University of Technology
Academic theses (ETDs) > Master’s theses
 Record created 2018-06-19, last modified 2022-09-04


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