Original title: Aplikace lepidel v mikroelektronických sestavách
Translated title: Applications of Adhesives in Microelectronics Assembly
Authors: Bolcek, Martin ; Jankovský, Jaroslav (referee) ; Szendiuch, Ivan (advisor)
Document type: Bachelor's theses
Year: 2017
Language: cze
Publisher: Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Abstract: [cze] [eng]

Keywords: die shear strenght; Electicall conductive adhesive; humidity chambre; micro cut; reliability; thermal conductiv adhesive; Elektricky vodivá lepidla; mikrovýbrus; pevnost ve střihu; spolehlivost; tepelně vodivá lepidla; vlhkostní komora

Institution: Brno University of Technology (web)
Document availability information: Fulltext is available in the Brno University of Technology Digital Library.
Original record: http://hdl.handle.net/11012/69408

Permalink: http://www.nusl.cz/ntk/nusl-363720


The record appears in these collections:
Universities and colleges > Public universities > Brno University of Technology
Academic theses (ETDs) > Bachelor's theses
 Record created 2017-08-31, last modified 2022-09-04


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