Original title: Spolehlivost pájených spojů LED panelů
Translated title: Reliability of LED Panels Solder Joints
Authors: Šimon, Vojtěch ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
Document type: Master’s theses
Year: 2017
Language: cze
Publisher: Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Abstract: [cze] [eng]

Keywords: defect; heating factor; heating profile; LED; reliability; solder paste; Soldering; soldering quality; strength; void; X-Ray; defekt; integrál teploty; kvalita spoje; LED; pevnost; pájecí pasta; Pájení; rentgen; spolehlivost; teplotní profil; void

Institution: Brno University of Technology (web)
Document availability information: Fulltext is available in the Brno University of Technology Digital Library.
Original record: http://hdl.handle.net/11012/67489

Permalink: http://www.nusl.cz/ntk/nusl-319627


The record appears in these collections:
Universities and colleges > Public universities > Brno University of Technology
Academic theses (ETDs) > Master’s theses
 Record created 2017-06-12, last modified 2022-09-04


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