Original title: Propojovací technologie pro 3D elektronické a mikroelektronické konstrukce
Translated title: Interconnection Technologies for 3D Electronic and Microelectronic Constructions
Authors: Nicák, Michal ; Pietriková,, Alena (referee) ; Starý, Jiří (referee) ; Šandera, Josef (advisor)
Document type: Doctoral theses
Year: 2016
Language: cze
Publisher: Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Abstract: [cze] [eng]

Keywords: 3D structures; ceramic; Interconnection; LTCC; package; solder balls; soldered joints; 3D struktury; keramika; LTCC; pouzdro; Propojení; pájecí kuličky; pájené spoje

Institution: Brno University of Technology (web)
Document availability information: Fulltext is available in the Brno University of Technology Digital Library.
Original record: http://hdl.handle.net/11012/63112

Permalink: http://www.nusl.cz/ntk/nusl-256547


The record appears in these collections:
Universities and colleges > Public universities > Brno University of Technology
Academic theses (ETDs) > Doctoral theses
 Record created 2016-09-20, last modified 2022-09-04


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