Original title: Reballing BGA pouzder na zařízení PACE TF2700
Translated title: REBALLING OF BGA PACKAGES USING PACE TF2700 EQUIPMENT
Authors: Roháček, Peter ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
Document type: Master’s theses
Year: 2016
Language: cze
Publisher: Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Abstract: [cze] [eng]
Diplomová práca je zameraná na reballing BGA (Ball Grid Array) puzdier pomocou zariadenia PACE TF 2700. Popisuje všeobecné druhy BGA puzdier, ich defekty, dôležitosť teplotného managementu až po techniky spájkovania, kde sa hovorí aj o význame spájok a tavidiel pre spoj. Práca informuje o najčastejších metódach reballingu, správnu manipuláciu so súčiastkami a momentálnu situáciu s BGA matricami na trhu. V krátkosti popisuje obsluhu zariadenia PACE TF 2700, ktoré v sebe združuje konvekčný a IR princíp ohrievania súčiastky. Záoberá sa výrobou prípravku, dummy puzdier BGA, testovacích dosiek, tvorbou teplotného profilu, porovnávaním a skúmaním defektov a ich príčin, ktoré mali značný vplyv na výsledky. Dosiahnuté výsledky by slúžili pre porovnanie výsledkov v budúcich laboratórnych cvičeniach alebo ako námet pre ďalšie práce. The Diploma thesis is focused on reballing of BGA packages with the device PACE TF 2700. It describes the general types of BGA packages, their defects, importance of thermal management to the solder techniques, where it is also talked about the meaning of solders and fluxes for the joint. The work informs about the most common methods of reballing, the proper handling of components and the current situation with BGA stencils on the market. It briefly describes the device operation of PACE TF 2700, that is working on the convection and IR principle of heating components. It deals with the manufacturing of the template, dummy BGA packages, the test plates, creation of the thermo profile, comparing and examining the defects and their causes, which had the most significant impact on the results. The achievements would serve for comparing them with the results of the future laboratory exercises or as a subject for further works.
Keywords: BGA; defects; ESD; MSD; PACE TF 2700; PCB; PSL; reballing; soldering; stencils; template.; thermal management; thermal profile; X-ray; BGA; defekty; DPS; ESD; matrice; MSD; PACE TF 2700; prípravok.; PSL; reballing; spájkovanie; teplotný management; teplotný profil; X-ray

Institution: Brno University of Technology (web)
Document availability information: Fulltext is available in the Brno University of Technology Digital Library.
Original record: http://hdl.handle.net/11012/60931

Permalink: http://www.nusl.cz/ntk/nusl-254471


The record appears in these collections:
Universities and colleges > Public universities > Brno University of Technology
Academic theses (ETDs) > Master’s theses