Original title: Prokovy v nízkoteplotní keramice
Translated title: The via interconnection in LTCC
Authors: Sedliak, Erik ; Klíma, Martin (referee) ; Kosina, Petr (advisor)
Document type: Bachelor's theses
Year: 2013
Language: cze
Publisher: Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Abstract: [cze] [eng]
Práca sa zaoberá problematikou technologických postupov tvorby 3D štruktúr na báze LTCC. Pozornosť je venovaná hlavne tvorbe prokovov, od vyrezania dier až po finalizáciu prokovu. Praktická časť bola zameraná na návrh a zhotovenie série prokovov s rôznymi parametrami a testovanie ich vlastností. Cieľom práce bolo zhodnotiť vplyv parametrov prokovu na jeho funkciu. This thesis deals with manufacturing process of LTCC 3D structures. Emphasis is placed mainly on the formation of via interconnections. In the second section of thesis, different via interconnections were designed, created and tested. Aim of this thesis was to evalute impact of via properties on vias function.
Keywords: 3D structure; HeraLock 2000; LTCC; via diameter; via interconnection; 3D štruktúra; HeraLock 2000; LTCC; priemer prokovu; prokov

Institution: Brno University of Technology (web)
Document availability information: Fulltext is available in the Brno University of Technology Digital Library.
Original record: http://hdl.handle.net/11012/12499

Permalink: http://www.nusl.cz/ntk/nusl-243746


The record appears in these collections:
Universities and colleges > Public universities > Brno University of Technology
Academic theses (ETDs) > Bachelor's theses