Original title: Únavové modely pro vyhodnocování spolehlivosti pájených spojů
Translated title: Creep-fatigue models for solder joints reliability prediction
Authors: Novotný, Václav ; Šandera, Josef (referee) ; Švecová, Olga (advisor)
Document type: Bachelor's theses
Year: 2011
Language: cze
Publisher: Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Abstract: [cze] [eng]

Keywords: Creep-Fatigue model; Estimation; Fatigue; Lead-Free solder; Reliability; Solder joint; bezolovnatá pájka; odhad; pájený spoj; spolehlivost; Únavový model; únava

Institution: Brno University of Technology (web)
Document availability information: Fulltext is available in the Brno University of Technology Digital Library.
Original record: http://hdl.handle.net/11012/17934

Permalink: http://www.nusl.cz/ntk/nusl-240660


The record appears in these collections:
Universities and colleges > Public universities > Brno University of Technology
Academic theses (ETDs) > Bachelor's theses
 Record created 2016-06-03, last modified 2022-03-03


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